Insights on the UV Tapes Global Market to 2027

The "UV Tapes Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2022-2027" report has been added to's offering.

DUBLIN, Jan. 24, 2023 /PRNewswire/ -- The "UV Tapes Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2022-2027" report has been added to's offering.

The global UV tapes market size reached US$ 420.8 Million in 2021. Looking forward, the publisher expects the market to reach US$ 700.2 Million by 2027, exhibiting a CAGR of 8.86% during 2021-2027.
Keeping in mind the uncertainties of COVID-19, we are continuously tracking and evaluating the direct as well as the indirect influence of the pandemic. These insights are included in the report as a major market contributor.UV tapes are under-pressure sensitive tapes made using base polymer, oligomer, and a photoinitiator. These tapes assist in coping with direct sunlight and other environmental factors. They provide a strong adhesive bond to multiple surfaces, thereby making them an ideal alternative to conventional duct tapes.
They are used to protect the surface of semiconductor wafers during the back grinding process and keep them along the ring frame during the dicing process. They are also applicable on ceramics, glass, sapphires, and plastics workpieces, which experience prolonged exposure to UV light.The rising adoption of smart and miniaturized consumer electronics on account of rapid urbanization, inflating disposable incomes, and the emergence of smart homes is escalating the demand for semiconductors across the globe.
This represents one of the key factors influencing the market growth positively. In line with this, increasing digitization and the rising trend of automation are promoting the adoption of semiconductor memory in modern medical devices, which, in turn, are contributing to the market growth.
Moreover, the burgeoning construction industry is stimulating the use of UV tapes for pipes, windows, open joint facades, and sealing around doors.
Apart from this, the growing utilization of flexographic printing in flexible packaging that minimizes product wastage and extends the shelf-life of various food and beverage (F&B) products is also propelling the market growth.
Furthermore, leading market players are developing innovative products, such as UV-activatable adhesive tape with color change features, which is augmenting their demand in the automotive industry. Besides this, rising awareness about the benefits offered by UV tapes, in confluence with the expanding distribution channel, is projected to foster the market growth.
Competitive Landscape:The competitive landscape of the industry has also been examined along with the profiles of the key players being AI Technology Inc., Chase Corporation, Denka Company Limited, Furukawa Electric Co. Ltd., LINTEC Corporation, Loadpoint Ltd, Minitron Elektronik GmbH, Mitsui Chemicals, Nitto Denko Corporation, Sumitomo Bakelite Co. Ltd. and Ultron Systems Inc.Key Questions Answered in This Report:
How has the global UV tapes market performed so far and how will it perform in the coming years?
What has been the impact of COVID-19 on the global UV tapes market?
What are the key regional markets?
What is the breakup of the market based on the product?
What is the breakup of the market based on the application?
What are the various stages in the value chain of the industry?
What are the key driving factors and challenges in the industry?
What is the structure of the global UV tapes market and who are the key players?
What is the degree of competition in the industry?
Key Topics Covered: 1 Preface2 Scope and Methodology3 Executive Summary4 Introduction4.1 Overview4.2 Key Industry Trends5 Global UV Tapes Market5.1 Market Overview5.2 Market Performance5.3 Impact of COVID-195.4 Market Forecast6 Market Breakup by Product6.1 Polyolefin6.1.1 Market Trends6.1.2 Market Forecast6.2 Polyvinyl Chloride6.2.1 Market Trends6.2.2 Market Forecast6.3 Polyethylene Terephthalate6.3.1 Market Trends6.3.2 Market Forecast6.4 Others6.4.1 Market Trends6.4.2 Market Forecast7 Market Breakup by Application7.1 Wafer Dicing7.1.1 Market Trends7.1.2 Market Forecast7.2 Back Grinding7.2.1 Market Trends7.2.2 Market Forecast7.3 Others7.3.1 Market Trends7.3.2 Market Forecast8 Market Breakup by Region9 SWOT Analysis10 Value Chain Analysis11 Porters Five Forces Analysis12 Price Analysis13 Competitive Landscape13.1 Market Structure13.2 Key Players13.3 Profiles of Key Players13.3.1 AI Technology Inc. Company Overview13.3.1.2 Product Portfolio13.3.2 Chase Corporation13.3.2.1 Company Overview13.3.2.2 Product Portfolio13.3.2.3 Financials13.3.3 Denka Company Limited13.3.3.1 Company Overview13.3.3.2 Product Portfolio13.3.3.3 Financials13.3.3.4 SWOT Analysis13.3.4 Furukawa Electric Co. Ltd. Company Overview13.3.4.2 Product Portfolio13.3.4.3 Financials13.3.4.4 SWOT Analysis13.3.5 LINTEC Corporation13.3.5.1 Company Overview13.3.5.2 Product Portfolio13.3.5.3 Financials13.3.6 Loadpoint Ltd13.3.6.1 Company Overview13.3.6.2 Product Portfolio13.3.7 Minitron Elektronik GmbH13.3.7.1 Company Overview13.3.7.2 Product Portfolio13.3.8 Mitsui Chemicals13.3.8.1 Company Overview13.3.8.2 Product Portfolio13.3.8.3 Financials13.3.8.4 SWOT Analysis13.3.9 Nitto Denko Corporation13.3.9.1 Company Overview13.3.9.2 Product Portfolio13.3.9.3 Financials13.3.9.4 SWOT Analysis13.3.10 Sumitomo Bakelite Co., Ltd. Company Overview13.3.10.2 Product Portfolio13.3.10.3 Financials13.3.11 Ultron Systems Inc. Company Overview13.3.11.2 Product Portfolio
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